Application Type
National Patent
Application SubType
(10) Registration Number and Date
Status
ACTIVE ( Other event occurred)
(180) Expiration Date
(20) Filing Number and Date
MY PI2025006834 2025.11.04
(40) Publication Number (Gazette Number) and Date
(85) National Entry Date
(30) Priority Details
CN
CN202411666472.0
2024.11.20
(51) IPC Classes
(71/73) Applicant
(72) Inventor
(EN) ZHU Feng You : No. 1239, Yizhou Avenue, Hi-Tech District, Chengdu City, Sichuan Province, 610041
JIANG Sheng Hui
(74) Representative
(EN) FOONG SEET FUN : C/O DREWMARKS PATENTS AND DESIGNS (M) SDN BHD, 9TH FLOOR, BANGUNAN GETAH ASLI (MENARA), 148, JALAN AMPANG, 50450 Wilayah Persekutuan
(54) Title
(EN) AUTOMATIC BONDING TOOL REPLACEMENT APPARATUS AND METHOD
(57) Abstract
(EN) A bonding tool replacement apparatus for inserting a bonding tool into a retaining hole of a wire bonding apparatus includes a frame, a bonding tool gripper and a compliant structure. The bonding tool gripper is supported by the frame and configured to grip the bonding tool and insert it into the retaining hole at an operation position associated with the wire bonding apparatus by moving the bonding tool toward the retaining hole. The compliant structure flexibly couples the bonding tool gripper to the frame to enable relative movement of the bonding tool gripper with respect to the frame. The compliant structure is configured to deform in response to misalignment between the bonding tool gripped by the bonding tool gripper and the retaining hole during insertion to allow the bonding tool to deflect into alignment with the retaining hole when the bonding tool and the retaining hole are misaligned. [FIG. 1A]
(58) Citations
License Details
(98) Annuity Details
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