A bonding tool replacement apparatus for inserting a bonding tool into a retaining hole of a wire bonding apparatus includes a frame, a bonding tool gripper and a compliant structure. The bonding tool gripper is supported by the frame and configured to grip the bonding tool and insert it into the retaining hole at an operation position associated with the wire bonding apparatus by moving the bonding tool toward the retaining hole. The compliant structure flexibly couples the bonding tool gripper to the frame to enable relative movement of the bonding tool gripper with respect to the frame. The compliant structure is configured to deform in response to misalignment between the bonding tool gripped by the bonding tool gripper and the retaining hole during insertion to allow the bonding tool to deflect into alignment with the retaining hole when the bonding tool and the retaining hole are misaligned. [FIG. 1A]