Application Type
National Patent
Application SubType
(10) Registration Number and Date
Status
ACTIVE ( Other event occurred)
(180) Expiration Date
(20) Filing Number and Date
MY PI2025006138 2025.10.03
(40) Publication Number (Gazette Number) and Date
(85) National Entry Date
(30) Priority Details
US
US63/702,658
2024.10.03
(51) IPC Classes
(71/73) Applicant
(72) Inventor
(EN) William Henry WILSON IV : c/o Molex, LLC, 2222 Wellington Court, Lisle, Illinois 60532
Jack Kenyan ARMITAGE
Jason W FERENS
Yingfen YI
(74) Representative
(EN) SOO EE LIN : C/O SPRUSON & FERGUSON (M) SDN. BHD., SUITE A-39-5 (LEVEL 39), MENARA UOA BANGSAR, TOWER A, NO. 5, JALAN BANGSAR UTAMA 1, 59000 Wilayah Persekutuan
(54) Title
(EN) COMPRESSION CONTACT INTERFACE ASSEMBLIES
(57) Abstract
(EN) Compression contact interface assemblies for high-speed data communication are described. An example assembly includes an interposer assembly, a halo for securing the interposer assembly to a printed circuit board (PCB), a plug connector that mates with the interposer assembly, and a latch clip that extends over the plug connector, clips into the halo, and secures the plug connector to the interposer assembly. The interposer assembly includes an interposer housing and an interposer conductive gasket positioned over a board-mating interface region of the interposer housing. The plug connector includes a plug housing and a plug conductive gasket positioned over a mating interface of the plug housing. The halo spans over the PCB and compresses the interposer assembly down upon a top surface of the PCB. The conductive gaskets offer additional shielding, and the interposer housing and interposer conductive gasket form a ground return path for data communication through the interface assembly. Fig. 1A
(58) Citations
License Details
(98) Annuity Details
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