<?xml version="1.0" encoding="UTF-8"?>

<wo-patent-document lang="en" status="Filed" country="MY">
  <wo-bibliographic-data status="Under Preliminary Examination">
    <application-reference>
      <document-id>
        <country>MY</country>
        <doc-number>PI2025006138</doc-number>
        <date>20251003</date>
      </document-id>
    </application-reference>
    <priority-claims>
      <priority-claim sequence="0001" kind="national">
        <country>US</country>
        <doc-number>63/702,658</doc-number>
        <date>20241003</date>
      </priority-claim>
    </priority-claims>
    <parties>
      <applicants>
        <applicant sequence="0001" app-type="applicant" designation="all">
          <addressbook lang="en">
            <name>Molex, LLC</name>
            <address>
              <address-1>2222 Wellington Court, Lisle, Illinois 60532</address-1>
              <country>US</country>
            </address>
          </addressbook>
          <nationality>
            <country/>
          </nationality>
          <residence>
            <country>US</country>
          </residence>
        </applicant>
      </applicants>
      <inventors>
        <inventor sequence="0001">
          <addressbook lang="en">
            <name>William Henry WILSON IV</name>
            <address>
              <address-1>c/o Molex, LLC, 2222 Wellington Court, Lisle, Illinois 60532</address-1>
              <country>US</country>
            </address>
          </addressbook>
        </inventor>
        <inventor sequence="0002">
          <addressbook lang="en">
            <name>Jack Kenyan ARMITAGE</name>
            <address>
              <address-1>c/o Molex, LLC, 2222 Wellington Court, Lisle, Illinois 60532</address-1>
              <country>US</country>
            </address>
          </addressbook>
        </inventor>
        <inventor sequence="0003">
          <addressbook lang="en">
            <name>Dennis M. BREEN IV</name>
            <address>
              <address-1>c/o Molex, LLC, 2222 Wellington Court, Lisle, Illinois 60532</address-1>
              <country>US</country>
            </address>
          </addressbook>
        </inventor>
        <inventor sequence="0004">
          <addressbook lang="en">
            <name>Joseph FAIA</name>
            <address>
              <address-1>c/o Molex, LLC, 2222 Wellington Court, Lisle, Illinois 60532</address-1>
              <country>US</country>
            </address>
          </addressbook>
        </inventor>
        <inventor sequence="0005">
          <addressbook lang="en">
            <name>Jason W FERENS</name>
            <address>
              <address-1>c/o Molex, LLC, 2222 Wellington Court, Lisle, Illinois 60532</address-1>
              <country>US</country>
            </address>
          </addressbook>
        </inventor>
        <inventor sequence="0006">
          <addressbook lang="en">
            <name>Augusto P. PANELLA</name>
            <address>
              <address-1>c/o Molex, LLC, 2222 Wellington Court, Lisle, Illinois 60532</address-1>
              <country>US</country>
            </address>
          </addressbook>
        </inventor>
        <inventor sequence="0007">
          <addressbook lang="en">
            <name>Yingfen YI</name>
            <address>
              <address-1>c/o Molex, LLC, 2222 Wellington Court, Lisle, Illinois 60532</address-1>
              <country>CN</country>
            </address>
          </addressbook>
        </inventor>
      </inventors>
      <agents>
        <agent sequence="0001" rep-type="agent">
          <addressbook lang="en">
            <name>SOO EE LIN</name>
            <address>
              <address-1>C/O SPRUSON &amp; FERGUSON (M) SDN. BHD., SUITE A-39-5 (LEVEL 39), MENARA UOA BANGSAR, TOWER A, NO. 5, JALAN BANGSAR UTAMA 1, 59000 Wilayah Persekutuan</address-1>
              <country>MY</country>
            </address>
          </addressbook>
        </agent>
      </agents>
    </parties>
    <invention-title lang="en">COMPRESSION CONTACT INTERFACE ASSEMBLIES</invention-title>
    <wo-national-office-event national-office-event-type="Filed" doc-number="PI2025006138" event-name="Filing">
      <wo-national-office-event-date>
        <date>20251003</date>
      </wo-national-office-event-date>
    </wo-national-office-event>
    <wo-national-office-event national-office-event-type="OPI" event-name="Open for public inspection">
      <wo-national-office-event-date>
        <date>20260403</date>
      </wo-national-office-event-date>
    </wo-national-office-event>
    <wo-national-office-filing-data appl-type="National Patent" file-type="">
      <kind-of-protection></kind-of-protection>
    </wo-national-office-filing-data>
  </wo-bibliographic-data>
  <abstract lang="en">
    <p num="0001">Compression contact interface assemblies for high-speed data communication are described. An example assembly includes an interposer assembly, a halo for securing the interposer assembly to a printed circuit board (PCB), a plug connector that mates with the interposer assembly, and a latch clip that extends over the plug connector, clips into the halo, and secures the plug connector to the interposer assembly. The interposer assembly includes an interposer housing and an interposer conductive gasket positioned over a board-mating interface region of the interposer housing. The plug connector includes a plug housing and a plug conductive gasket positioned over a mating interface of the plug housing. The halo spans over the PCB and compresses the interposer assembly down upon a top surface of the PCB. The conductive gaskets offer additional shielding, and the interposer housing and interposer conductive gasket form a ground return path for data communication through the interface assembly. Fig. 1A</p>
  </abstract>
</wo-patent-document>
