MY PI2025005730 20250922 JP 2024-169239 20240927 FUJIMI INCORPORATED
1-1, Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-shi, Aichi 4528502 JP
JP Tomohide KAMIYA
c/o FUJIMI INCORPORATED, 1-1, Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-shi, Aichi, , 4528502 JP
Takahiro OSHIMA
c/o FUJIMI INCORPORATED, 1-1, Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-shi, Aichi, , 4528502 JP
Kazumasa SATO
c/o FUJIMI INCORPORATED, 1-1, Chiryo 2-chome, Nishibiwajima-cho, Kiyosu-shi, Aichi, 4528502 JP
LINDA WANG CHAW LING
C/O LINDA WANG SU & BOO (a member of Zico IP) LEVEL 7 MENARA MILENIUM, JALAN DAMANLELA, PUSAT BANDAR DAMANSARA, 50490 Wilayah Persekutuan MY
POLISHING COMPOSITION, METHOD FOR PRODUCING SUBSTRATE AND POLISHING METHOD 20250922 20260327

Provided is a polishing composition that includes a silica abrasive and can maintain low micro-waviness while achieving superior removal ability. A polishing composition for a magnetic disk substrate is provided. The polishing composition includes silica particles as an abrasive, an acid and an oxidant. Here, the silica particles have a 25th percentile aspect ratio of 1.30 or lower and a 75th percentile aspect ratio of 1.20 or higher and 3.00 or lower in its volume-based aspect ratio distribution.