A substrate with a hinge is disclosed. In one aspect, the substrate may be a printed circuit board (PCB) or the like with a socket configured to receive a memory module, such as a dual inline memory module (DIMM). The substrate further includes a hinge that allows the portion of the substrate with the socket to rotate ninety (90) degrees so that a memory module inserted into the socket is then parallel to the other portion of the substrate. By allowing the memory module to be so positioned, the overall shape and configuration of a module using the substrate may fit a smaller form factor.